| 主要性能表 | |||||||
| 测试项目 | 单位 | 测试条件 | 技术标准 | 典型值 | 测试方法 | ||
| HY2DB1003EH | HY2DB1005EH | ||||||
| 结构 | --- | --- | --- | 1/3 oz Cu | 1/2 oz Cu | --- | |
| 1.0mil TPI | 1.0mil TPI | ||||||
| 1/3 oz Cu | 1/2 oz Cu | ||||||
| 厚度 | µm | A | ±10% | 49 | 61 | 鸿宇规范 | |
| 抗剥强度 | kgf/cm | A | ≧0.8 | ≧1.0 | ≧1.0 | IPC-TM-650 2.4.9 | |
| 尺寸稳定性 | TD | % | Method B | ≦±0.10 | -0.01~0.06 | -0.01~0.06 | IPC-TM-650 2.2.4 |
| MD | 0~0.07 | 0~0.07 | |||||
| TD | Method C | ≦±0.10 | -0.02~0.05 | -0.02~0.05 | |||
| MD | -0.01~0.06 | -0.01~0.06 | |||||
| 焊锡耐热性 | --- | E-1/150 | 288℃/10s 无分层起泡 |
300℃/30s 无分层起泡 |
300℃/30s 无分层起泡 |
IPC-TM-650 2.4.13 | |
| MIT耐折性 | Cycles | 常态 | ≥120 | ≥180 | ≥200 | JIS C6471-1995 8.2 | |
| 吸水率 | % | D-24/23 | ≦2.0 | ≦1.2 | ≦1.2 | IPC-TM-650 2.6.2 | |
| 体积电阻 | Ω-cm | C-96/23/65 | ≧1013 | ≧ 1×1015 | ≧ 1×1015 | IPC-TM-650 2.5.17 | |
| 表面电阻 | Ω | ≧1012 | ≧ 1×1013 | ≧ 1×1013 | |||
| 介电常数(1GHz) | --- | C-24/23/50 | ≦4.0 | 3.2 | 3.2 | IPC-TM-650 2.5.5.3 | |
| 介质损耗因子(1GHz) | --- | ≦0.01 | 0.003 | 0.003 | |||
| 阻燃性 | --- | --- | V-0/ VTM-0 | V-0 | V-0 | UL94 |
|
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