Lithium-ion battery copper foil PCB copper foils Flexible copper clad laminate R&D and Manufacturing Service and Support

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Hyper Very Low Profile Copper Foil (HVLP)

NO product gauge Units Product gauge
1 Nominal Thickness μm 9 12 18 35
2 Area Weight g/m² 80±3 107±3 153±5 283±5
3 Purity % min.99.8
4 Surface Roughness S side(Ra) μm max.0.43
M side(Rz) max.2.0
5 Tensile Strength R.T.(23°c) MPa min.280
H.T.(180°c) min.150
6 Elongation R.T.(23°c) % min.5.0 min.6.0 min.10.0
H.T.(180°c) min.2.0 min.3.0
7 Peel Strength FR-4 N/mm min.0.7 min.0.8 min.0.9 min.1.0
8 Chemical Resistance   % max.5.0
9 Dip soldering resistance   sec. min.20
10 Anti-oxidization R.T.(23°c) Days 180
H.T.(200°c) Minutes 30

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M Side magnified by 2,000 times

M Side magnified by 1,000 times

S Side magnified by1,000 times

S Side magnified by 5,000 times