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Measured parameters Unit Test Condition Technology Standard Typical Value Test Method
HY2DF0803ER HY2DF1003ER HY2DF1005ER
Structure --- --- --- 1/3 oz Cu 1/3 oz Cu 1/2 oz Cu ---
0.8mil TPI 1.0mil TPI 1.0mil TPI
1/3 oz Cu 1/3 oz Cu 1/2 oz Cu
Thickness µm A ±10% 44 49 61 Internal Testing Standards
Peel Strength kgf/cm A ≧0.8 ≧1.0 ≧1.0 ≧1.0 IPC-TM-650 2.4.9
Dimensional Stability  TD % Method B ≦±0.10 -0.02~0.05 -0.01~0.06 -0.01~0.06 IPC-TM-650 2.2.4
MD 0~0.07 0~0.07 0~0.07
TD Method C ≦±0.10 -0.03~0.04 -0.02~0.05 -0.02~0.05
MD -0.01~0.06 -0.01~0.06 -0.01~0.06
Solder Resistance --- E-1/150 288℃/10s
No layered foaming		 300℃/30s
No layered foaming		 300℃/30s
No layered foaming		 300℃/30s
No layered foaming		 IPC-TM-650 2.4.13
MIT Cycles Normal ≥120 ≥180 ≥180 ≥200 JIS C6471-1995 8.2
Water Absorption % D-24/23 ≦2.0 ≦1.2 ≦1.2 ≦1.2 IPC-TM-650 2.6.2
Volume Resistance  Ω-cm C-96/23/65 ≧1013 ≧ 1×1015 ≧ 1×1015 ≧ 1×1015 IPC-TM-650 2.5.17
Surface Resistance Ω ≧1012 ≧ 1×1013 ≧ 1×1013 ≧ 1×1013
Dielectric Constant(1GHz) --- C-24/23/50 ≦4.0 3.3 3.4 3.4 IPC-TM-650 2.5.5.3
Dissipation Factor (1GHz) --- ≦0.03 0.013 0.013 0.013

Flammability		 --- --- V-0/ VTM-0 VTM-0 V-0 V-0 UL94
                 
Note: The above data is for reference only, please refer to the shipping report for details.        

Product diagram