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High frequency electrolytic substrate products

General Properties        

Measured parameters
Unit
Test Condition
Technology Standard
Typical Value
Test Method
HY2DB1003EH HY2DB1005EH

Structure		 --- --- --- 1/3 oz Cu 1/2 oz Cu ---
1.0mil TPI 1.0mil TPI
1/3 oz Cu 1/2 oz Cu

Thickness		 µm A ±10% 49 61 Internal Testing Standards

Peel Strength		 kgf/cm A ≧0.8 ≧1.0 ≧1.0 IPC-TM-650 2.4.9

Dimensional Stability 		 TD % Method B ≦±0.10 -0.01~0.06 -0.01~0.06 IPC-TM-650 2.2.4
MD 0~0.07 0~0.07
TD Method C ≦±0.10 -0.02~0.05 -0.02~0.05
MD -0.01~0.06 -0.01~0.06

Solder Resistance		 --- E-1/150 288℃/10s
No layered foaming		 300℃/30s
No layered foaming		 300℃/30s
No layered foaming		 IPC-TM-650 2.4.13
MIT Cycles Normal ≥120 ≥180 ≥200 JIS C6471-1995 8.2

Water Absorption		 % D-24/23 ≦2.0 ≦1.2 ≦1.2 IPC-TM-650 2.6.2

Volume Resistance 		 Ω-cm C-96/23/65 ≧1013 ≧ 1×1015 ≧ 1×1015 IPC-TM-650 2.5.17

Surface Resistance		 Ω ≧1012 ≧ 1×1013 ≧ 1×1013
Dielectric Constant(1GHz) --- C-24/23/50 ≦4.0 3.2 3.2 IPC-TM-650 2.5.5.3
Dissipation Factor (1GHz) --- ≦0.01 0.003 0.003
Flammability --- --- V-0/ VTM-0 V-0 V-0 UL94
 

Product diagram